The EagerLED COB LED Module uses chip-on-board (COB) packaging to mount red, green, and blue LED chips directly onto a printed circuit board (PCB). This supports higher chip density while creating a flat, uniform surface for fine-pitch displays. Each COB LED Display Module is designed for high color gamut and true-to-life imagery across close-viewing LED display applications.

COB LED Module Packaging Technology
Different from the traditional SMD surface-mount package, COB packaging technology is to integrate the light-emitting chips into the PCB board, rather than welding on the PCB one by one. This encapsulation not only simplifies the production process, but also significantly improves the overall performance of the LED display. COB encapsulation technology is generally divided into flip-chip COB and front-mounted COB. Compared with the traditional front-mounted technology, flip-chip COB presents unique features in terms of appearance, size, and heat dissipation performance.

Flip-Chip COB

Front-Mounted COB
COB LED Display Module Visual Performance
A COB module uses a surface light source, while an SMD LED module uses a point light source. This gives the COB LED display a smoother, particle-free visual appearance that is suitable for close viewing. COB LED displays also provide a higher contrast ratio than SMD LED screens, with vivid colours and visuals closer to an LCD screen. These characteristics support applications that require accurate colour display, including weather broadcasting halls and studios.

COB LED Module Stability and Protection
COB technology reduces the package size of the LED module, improving display reliability while supporting a lighter structure that is easier to install and maintain. The compact COB package also provides waterproof, anti-collision, anti-bump, and moisture-proof performance with a smooth, hard surface.

Fine-Pitch COB LED Module Picture Quality
COB packaging removes the traditional SMD lamp-bead package structure to support smaller pixel pitches. Available COB display pixel pitches are typically below 2.0 mm, including P0.62, P0.78, P0.93, P1.25, and P1.53. The resulting higher pixel density and more detailed image quality make the fine-pitch COB display module suitable for close-viewing, ultra-high-definition applications.
COB LED Display Module Aging Test
320x160mm Series COB LED Module
150×168.75mm Series COB LED Display Module
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