Do you know GOB LED modules? GOB also called glue on board, which is an innovative technology that directly glue on the LED module surface, making LED modules have high anti-collision and anti-humidity performance.

Now, we will introduce the main difference between GOB LED modules and traditional LED modules.

Encapsulation Object:

GOB Module: Encapsulate the PCB board with LED beads using optical adhesive.

COB Module: Mounts LED chips directly onto the PCB board.

Protection Performance:

GOB Module: It provides excellent protection by shielding LED beads effectively from dust, moisture and impact.

COB Module: A relatively weaker protection that requires additional measures to safeguard the LED chips.

Heat Dissipation:

GOB Module: GOB has a good thermal conductivity that helps LED beads dissipate heat.

GOB Module: GOB technology is relatively less efficient at dissipating heat, so it requires additional measures to reduce LED chip temperatures.

Brightness and Contrast:

GOB : GOB module has lower brightness and higher contrast.

COB : COB module has higher brightness and lower contrast.

Application Scenarios:

GOB Module: GOB technology is ideal for outdoor displays, rental displays, and stage displays that require high protection.

GOB Module: COB technology is ideal for indoor displays and displays with a small pitch. It’s also suitable for high-end displays that require high brightness and contrast.