Chip-on-Board (COB) technology is a method of mounting red, green and blue chips directly onto a printed circuit board (PCB). Packaging bare chips directly onto a PCB allows for higher chip density while creating a flat, uniform LED surface. All COB LED modules with higher color gamut and the best true-to-life imagery to ensure the LED display has excellent visual effect.
COB Packaging Technology
Different from the traditional SMD surface-mount package, COB packaging technology is to integrate the light-emitting chips into the PCB board, rather than welding on the PCB one by one. This encapsulation not only simplifies the production process, but also significantly improves the overall performance of the LED display. COB encapsulation technology is generally divided into flip-chip COB and front-mounted COB. Compared with the traditional front-mounted technology, flip-chip COB presents unique features in terms of appearance, size, and heat dissipation performance.
Flip-Chip COB
Front-Mounted COB
Excellent Display Effect
COB LED module is a surface light source, but SMD LED module is a point light source. Therefore, the visual perception of COB LED display is better, no particles, more suitable for close viewing. The contrast ratio of COB LED displays is higher than the SMD LED screen. When viewed from the front, the COB screen viewing effect is closer to the LCD screen, with vibrant and vivid colours and better visuals. This is especially important for applications that require an accurate colour display, such as weather broadcasting halls and studios.
Stability and High Protection
COB technology significantly reduces the package size of the LED module, which not only improves the overall performance and reliability of the LED display, but also makes the LED display more lightweight. It is easier to install and maintain. COB LED module has a higher level of protection, waterproof, anti-collision, anti-bump, and moistureproof performance, with a smooth and hard surface.
High Definition Picture Quality
COB LED module does not have the traditional SMD package in the lamp bead structure, to achieve a smaller point pitch. The pixel pitch of COB display is usually below 2.0mm, such as P0.62, P0.78, P0.93, P1.25, P1.53, etc., in the field of ultra-high-definition display has unparalleled advantages. Smaller dot pitch means higher pixel density and more delicate picture quality performance, which can satisfy the audience’s demand for high-definition picture quality.
COB LED Display Aging Test
320x160mm Series COB LED Module
150Ă—168.75mm Series COB LED Display
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